一、个人简介
殷达，男，1991年4月，河北沙河，讲师，博士研究生，电子信息工程学院教师
二、学习与工作经历
2011年9月-2015年6月 河北科技大学，电子科学与技术专业，工学学士学位；
2016年9月-2021年6月 河北工业大学，电子科学与技术专业，工学博士学位；
2021年8月-至今 廊坊师范学院，电子信息工程学院教师，讲师；
三、主讲课程
《电路》、《嵌入式系统设计》、《ARM技术及应用》、《单片机原理与应用》
四、研究方向
微电子技术与材料
五、科研工作与成果
近5年主持1项河北省教育厅青年拔尖项目课题，第一作者或通讯作者发表SCI论文9篇，
河北省教育厅青年拔尖项目，BJK2023120，阻挡层 CMP 及后清洗中抑制剂的吸脱附机理与缺陷控制技术研究，2023.01-2025.12，9万，在研，主持。
[1] Da Yin, Xinhuan Niu, Kai Zhang, et al. Preparation of MgO doped colloidal SiO2 abrasive and their chemical mechanical polishing performance on c-, r- and a-plane sapphire substrate [J]. Ceramics International, 2018, (44):14631-14637. (SCI检索，JCR一区)
[2] Da Yin, Xinhuan Niu, Liu Yang, et al. Effect of Sr(OH)2 as a pH Regulator on Different Plane Sapphire Substrate Chemical Mechanical Polishing[J]. ECS Journal of Solid State Science and Technology, 2019, 8(2): P63-P69. (SCI检索，JCR二区)
[3] Da Yin, Liu Yang, Xinhuan Niu, et al. Theoretical and electrochemical analysis on inhibition effect of benzotriazole and 1,2,4-triazole on cobalt surface[J]. Colloids and Surface A-Physicochemical and Engineering Aspects, 2020, (591): 124516. (SCI检索，JCR二区)
[4] Da Yin, Liu Yang, Tengda Ma, et al. Synergistic effect of composite complex agent on BTA removal in post CMP cleaning of copper interconnection[J]. Materials Chemistry and Physics, 2020, (252): 1223230. (SCI检索，JCR二区)
[5] Da Yin, Siyu Tian, Nannan Zhang, et al. Synergistic Effect of LABSA/JFCE Combined Surfactant System on the Removal of Particles on Copper Wafer Surface[J]. Materials Chemistry and Physics, 2020(257):123841. (SCI检索，JCR二区)
[6] Da Yin, Qi Wang, Shihao Zhang, et al. Effect of EDTA-based alkaline cleaning solution on TAZ removal in post CMP cleaning of copper interconnection[J]. Materials Research Bulletin, 2021(137):111202. (SCI检索，JCR二区)
[7] Da Yin, Liu Yang, Baimei Tan, et al. Theoretical and electrochemical analysis on inhibition effects of benzotriazole derivatives (un- and methyl) on copper surface[J]. Journal of Molecular Structure, 2021 (1243):130871. (SCI检索，JCR三区)
[8] Liu Yang, Da Yin, Baimei Tan, et la. Composite complex agent based on organic amine alkali for BTA removal in post CMP cleaning of copper interconnection[J]. Journal of Electroanalytical Chemistry, 2022 (910):116187. (SCI检索，JCR一区)
[9] Liu Yang, Da Yin, Wenqian Zhang, et la. Composite surfactant based on AEO and ADS for colloidal silica particles removal in post CMP cleaning of copper interconnection[J]. Materials Science in Semiconductor Processing, 2023 (164):107620. (SCI检索，JCR二区)
六、主要获奖情况
河北省优秀博士学位论文
廊坊师范学院优秀毕业论文指导教师
